HOLOPLOT X1

The world's first Matrix Array

HOLOPLOT X1

HOLOPLOT X1 Matrix Array

X1 is a groundbreaking product series that creates an entirely new category of sound system. As the logical continuation of two landmark innovations in audio – line arrays and electronic beam steering – the Matrix Array finally brings complete sound control in horizontal and vertical axes through a matrix of loudspeaker drivers.

The HOLOPLOT X1 series features two Audio Modules, Modul 96 and Modul 80-S. Each Audio Module integrates a powerful DSP, providing individual signal processing to each loudspeaker driver. Combining the latest technological advancements in DSP algorithms with high-performance sound reproduction capabilities, X1 offers a wide range of previously inaccessible sound control capabilities – from covering large audiences homogeneously to creating immersive audio landscapes. X1 is an IoT-enabled system that opens a world of possibilities for remote control, monitoring, and smart servicing. The X1 Rigging System makes X1 the ideal solution for fully integrated installations, temporary installs and rental projects. From multi-purpose event spaces to large-scale live entertainment venues, auditoriums, concert halls or theme parks - X1 will transform sound experiences inside any given space. Custom rigging solutions can be discussed upon request.

HOLOPLOT X1. The sound system for a new era - enabling you to turn your most ambitious ideas into reality.

Matrix design

Control sound in all dimensions

OPEN
CLOSE

Matrix design

Control sound in all dimensions

The HOLOPLOT Matrix Array enables a new level of sound control.

The matrix arrangement of loudspeaker drivers of different sizes – in a unique multi-layered configuration – enables control over sound propagation across a large frequency range, while providing the SPL and quality desired for high-performance sound reproduction.

The Modul 96 (MD96) is a two-way Audio Module integrating 96 drivers in a two-layered matrix design. The Modul 80-S (MD80-S) is a three-way Audio Module with 80 drivers in its first two matrix layers and a sensor-controlled subwoofer driver in its third layer.

Individual amplification channels for each driver are integrated into the X1 Audio Modules, eliminating the need to provide separate amplification racks.

Modul 96
Modul 96
Modul 80-S
Modul 80-S

Powerful processing

Create up to 12 beams per array

OPEN
CLOSE

Powerful processing

Create up to 12 beams per array

Each HOLOPLOT X1 Audio Module is equipped with a specialized processing module that integrates the strengths of two worlds.

First, a dual-core ARM® Cortex™-A9 runs HOLOPLOT OS, a Linux-based, distributed audio operating system. Second, a high-performance Field Programmable Gate Array (FPGA) computes the HOLOPLOT proprietary digital signal processing algorithms for 3D Audio-Beamforming and Wave Field Synthesis. This powerful DSP provides individual control to each of the 96 drivers of the X1 Audio Module and gives full sound field control for multiple beams in both horizontal and vertical directions.

Each Audio Module provides more than 200 input channels fed with either object-based or channel-based audio streams. A routing matrix running on the FPGA downmixes these 200 channels into 12 individually controlled beams. Each beam can be equalized and tailored to taste by 24 parametric EQ bands.

Cloud-connected system

IoT backbone for monitoring, control, and updates

OPEN
CLOSE

Over-the-air updates & upgrades

Performance enhancements, security updates, and new features improving your system over time.

Remote monitoring & system management

Access via the cloud to monitor system state and to take control when needed.

Synced with HOLOPLOT Cloud

All system monitoring and configuration data is automatically stored and backed up for a lifetime.

Proactive support

Should an issue related to your system occur, HOLOPLOT will know and take actions proactively to minimize downtime.

Smart problem identification & resolution

Extensive monitoring data is available to HOLOPLOT support, making cumbersome explanations via phone a thing of the past.

Analysis of long-term system and usage data

System and usage data help HOLOPLOT improve the product and guide your service staff to maximize the benefits of your HOLOPLOT System.

Full introspection

Loudspeakers aware of their position, environment, and health

OPEN
CLOSE

Orientation sensors

Automatically detect Audio Module’s orientation.

Infrared transceivers

Recognize the Audio Module’s neighbors and automatically configure arrays.

Electric & acoustic self-tests

Verify system functionality and check component health based on multiple in-device sensors.

Front-facing LEDs

Can be activated from remote and make it easy to locate any Audio Module in the venue.

Color touch screen

Displays status and system messages, enabling service staff to provide directed and targeted troubleshooting.

Integration of external sensor-data

Allows an X1 system to respond to changing environmental conditions – like room temperature and humidity – and ensures optimal sound field configuration.

Modular design

Scalable to endless applications

OPEN
CLOSE

Modular design

Scalable to endless applications

arrow-down
With a centralized Matrix Array, sound propagation can be tailored to cover an audience area and precisely target one or multiple zones - achieving an unprecedented level uniformity and tonal balance across all seats, while minimizing unwanted reflections from walls or ceilings.
With a centralized Matrix Array, sound propagation can be tailored to cover an audience area and precisely target one or multiple zones - achieving an unprecedented level uniformity and tonal balance across all seats, while minimizing unwanted reflections from walls or ceilings.
Both left and right Matrix Arrays are optimized to cover the entire audience homogeneously, providing precise sound source localization across the stage for every audience member. Further, room excitation is reduced due to the precise coverage, delivering sound with unparalleled brilliance and clarity.
Both left and right Matrix Arrays are optimized to cover the entire audience homogeneously, providing precise sound source localization across the stage for every audience member. Further, room excitation is reduced due to the precise coverage, delivering sound with unparalleled brilliance and clarity.
An additional continuous Matrix Array above the stage (“proscenium array”), combined with a surround layer of distributed Audio Modules, enables moving audio objects smoothly around the audience, with precise localization of sound sources across the entire room. This configuration delivers the ultimate immersive experience, making full use of HOLOPLOT’s creative potential.
An additional continuous Matrix Array above the stage (“proscenium array”), combined with a surround layer of distributed Audio Modules, enables moving audio objects smoothly around the audience, with precise localization of sound sources across the entire room. This configuration delivers the ultimate immersive experience, making full use of HOLOPLOT’s creative potential.

X1 Rigging System

Simple, flexible deployment

OPEN
CLOSE

X1 Rigging System

Simple, flexible deployment

arrow-down
The X1 rigging system is designed to locate and secure the HOLOPLOT X1 Audio Modules MD96 and MD80-S in permanent and temporary installations. The system consists of a number of structural components which have been designed for the flexible, easy, and safe deployment of a HOLOPLOT Matrix Array.
The X1 rigging system is designed to locate and secure the HOLOPLOT X1 Audio Modules MD96 and MD80-S in permanent and temporary installations. The system consists of a number of structural components which have been designed for the flexible, easy, and safe deployment of a HOLOPLOT Matrix Array.
X1 Liftplates (Left & Right) connect the X1 Liftbar at the top of each column to the X1 Sideplates on the top Audio Module. There are no moving or loose parts on the X1 Liftbars. Mounting holes are available to influence the array tilt angle. Notches at the top of the bars index hole positions. Construction is welded steel fastened with screws.
X1 Liftplates (Left & Right) connect the X1 Liftbar at the top of each column to the X1 Sideplates on the top Audio Module. There are no moving or loose parts on the X1 Liftbars. Mounting holes are available to influence the array tilt angle. Notches at the top of the bars index hole positions. Construction is welded steel fastened with screws.
The X1 Liftbar transfers the load of the entire X1 array to a rigging point. One X1 Liftbar is required at the top of each column. Two captive quick release pins (QRP) are available for attachment to the X1 Liftbars. There are 3 x 21 mm holes in the top of the X1 Liftbar locations to accommodate 3.75T shackles. Construction is welded steel.
The X1 Liftbar transfers the load of the entire X1 array to a rigging point. One X1 Liftbar is required at the top of each column. Two captive quick release pins (QRP) are available for attachment to the X1 Liftbars. There are 3 x 21 mm holes in the top of the X1 Liftbar locations to accommodate 3.75T shackles. Construction is welded steel.
X1 Sideplates (left & right) are affixed to the left and right MD96 or MD80-S Audio Modules. Assembled from steel sheets and screwed together around locking components. There are different X1 Sideplate parts for the left and right sides of the Audio Module. The MD96 and MD80-S both use the same X1 Sideplate assemblies. X1 Sideplates are hung from other X1 Sideplates, or X1 Liftbars using an internal locking bar that is opened and secured with front-accessible levers.
X1 Sideplates (left & right) are affixed to the left and right MD96 or MD80-S Audio Modules. Assembled from steel sheets and screwed together around locking components. There are different X1 Sideplate parts for the left and right sides of the Audio Module. The MD96 and MD80-S both use the same X1 Sideplate assemblies. X1 Sideplates are hung from other X1 Sideplates, or X1 Liftbars using an internal locking bar that is opened and secured with front-accessible levers.

X1 Modul 96

Two-way Audio Module

OPEN
CLOSE

X1 Modul 96

Two-way Audio Module

Configuration: Two-layer Matrix Arrangement

LF layer 18x 5-inch cone driver in individual dual-ported chambers
HF layer 78x 1.3-inch soft dome tweeter with integrated waveguides

Maximum SPL (one unit, optimized parallel beam configuration*)

* Max. SPL capabilities are dependent on beam configuration and array size, and should be assessed using HOLOPLOT Software Tools ** Peak level referred back to 1 m under free field conditions using band-limited pink noise with crest factor 4
LF layer 142 dB**
HF layer 152 dB**

Frequency

Frequency Resp. (±3 dB) 100 - 18,000 Hz
Frequency Resp. (-10 dB) 85 - 20,000 Hz

Processing

Type High-performance FPGA for advanced digital signal processing
DSP channels 96
Computation 7600 parametric EQ bands and more than 1100 Finite Impulse Response (FIR) filters with over 430000 filter taps

Beamforming capabilities: HOLOPLOT 3D Audio Beamforming Technology and Wave Field Synthesis

Number of beams

Up to 12 beams in parallel per X1 Matrix Array:

  • 8 fully user-configurable parametric beams and virtual sources
  • 4 beams providing optimized coverage over a predefined audience area
Vertical directivity Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage
Horizontal directivity    Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage
arrow-down

Amplification

Peak power based on the maximum unclipped voltage the amplifier will produce into the nominal load impedance
Type 6x 16-channel digital amplifier modules
Max. output power

HF: 78x 240 Wpk

LF: 18x 500 Wpk

Connectors

Control etherCON for Control Network
Audio etherCON for Audio-over-IP: Dante™, AES67
Power

AC Power IN (115 - 240 V AC, 50 - 60 Hz)

AC Power OUT (208 - 240 V AC, 50 - 60 Hz)

Measurements

Dimensions 800 mm x 600 mm x 457 mm (±2.5 mm)
Weight 100 kg / 220 lb
download manual download datasheet
arrow-down
download manual download datasheet

X1 Modul 80-S

Three-way Audio Module

OPEN
CLOSE

X1 Modul 80-S

Three-way Audio Module

Configuration: Three-layer Matrix Arrangement

Sub layer 1x 18-inch sensor-controlled subwoofer with two high energy, high density neodymium-iron-boron magnets in a bandpass enclosure with air-flow optimised ports
LF layer 16x 5-inch cone driver in individual dual-ported chambers
HF layer 64x 1.3-inch soft dome tweeter with integrated waveguides

Maximum SPL (one unit, optimized parallel beam configuration*)

* Max. SPL capabilities are dependent on beam configuration and array size, and should be assessed using HOLOPLOT Software Tools ** Peak level referred back to 1 m under free field conditions using band-limited pink noise with crest factor 4
Sub layer 131 dB (full space) / 137 dB (half space)**
LF layer 142 dB**
HF layer 152 dB**

Frequency

Frequency Resp. (±3 dB) 30 - 18,000 Hz
Frequency Resp. (-10 dB) 26 - 20,000 Hz

Processing

Type High-performance FPGA for advanced digital signal processing
DSP channels 81
Computation 7600 parametric EQ bands and more than 1100 Finite Impulse Response (FIR) filters with over 430000 filter taps

Beamforming capabilities: HOLOPLOT 3D Audio Beamforming Technology and Wave Field Synthesis

Number of beams

Up to 12 beams in parallel per X1 Matrix Array:

  • 8 fully user-configurable parametric beams and virtual sources
  • 4 beams providing optimized coverage over a predefined audience area
Vertical directivity Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage
Horizontal directivity    Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage
arrow-down

Amplification

Peak power based on the maximum unclipped voltage the amplifier will produce into the nominal load impedance
Type

5x 16-channel digital amplifier modules


1x single-channel digital subwoofer amplifier module with differential pressure sensor and zero-latency-DSP for adaptive closed-loop processing of the subwoofer driver signal
Max. output power

Sub: 8,500 Wpk

LF: 16x 500 Wpk

HF: 64x 240 Wpk

Connectors

Control etherCON for Control Network
Audio etherCON for Audio-over-IP: Dante™, AES67
Power

AC Power IN (115 - 240 V AC, 50 - 60 Hz)

AC Power OUT (208 - 240 V AC, 50 - 60 Hz)

Measurements

Dimensions 800 mm x 600 mm x 981 mm (±2.5 mm)
Weight 160 kg / 353 lb
download manual download datasheet
arrow-down
download manual download datasheet