X1 is a groundbreaking product series that creates an entirely new category of sound system. As the logical continuation of two landmark innovations in audio – line arrays and electronic beam steering – the Matrix Array finally brings complete sound control in horizontal and vertical axes through a matrix of loudspeaker drivers.
The HOLOPLOT X1 series features two Audio Modules, Modul 96 and Modul 80-S. Each Audio Module integrates a powerful DSP, providing individual signal processing to each loudspeaker driver. Combining the latest technological advancements in DSP algorithms with high-performance sound reproduction capabilities, X1 offers a wide range of previously inaccessible sound control capabilities – from covering large audiences homogeneously to creating immersive audio landscapes. X1 is an IoT-enabled system that opens a world of possibilities for remote control, monitoring, and smart servicing. The X1 Rigging System makes X1 the ideal solution for fully integrated installations, temporary installs and rental projects. From multi-purpose event spaces to large-scale live entertainment venues, auditoriums, concert halls or theme parks - X1 will transform sound experiences inside any given space. Custom rigging solutions can be discussed upon request.
HOLOPLOT X1. The sound system for a new era - enabling you to turn your most ambitious ideas into reality.
The HOLOPLOT Matrix Array enables a new level of sound control.
The matrix arrangement of loudspeaker drivers of different sizes – in a unique multi-layered configuration – enables control over sound propagation across a large frequency range, while providing the SPL and quality desired for high-performance sound reproduction.
The Modul 96 (MD96) is a two-way Audio Module integrating 96 drivers in a two-layered matrix design. The Modul 80-S (MD80-S) is a three-way Audio Module with 80 drivers in its first two matrix layers and a sensor-controlled subwoofer driver in its third layer.
Individual amplification channels for each driver are integrated into the X1 Audio Modules, eliminating the need to provide separate amplification racks.
Each HOLOPLOT X1 Audio Module is equipped with a specialized processing module that integrates the strengths of two worlds.
First, a dual-core ARM® Cortex™-A9 runs HOLOPLOT OS, a Linux-based, distributed audio operating system. Second, a high-performance Field Programmable Gate Array (FPGA) computes the HOLOPLOT proprietary digital signal processing algorithms for 3D Audio-Beamforming and Wave Field Synthesis. This powerful DSP provides individual control to each of the 96 drivers of the X1 Audio Module and gives full sound field control for multiple beams in both horizontal and vertical directions.
Each Audio Module provides more than 200 input channels fed with either object-based or channel-based audio streams. A routing matrix running on the FPGA downmixes these 200 channels into 12 individually controlled beams. Each beam can be equalized and tailored to taste by 24 parametric EQ bands.
Configuration: Two-layer Matrix Arrangement
LF layer | 18x 5-inch cone driver in individual dual-ported chambers |
HF layer | 78x 1.3-inch soft dome tweeter with integrated waveguides |
Maximum SPL (one unit, optimized parallel beam configuration*)
LF layer | 142 dB** |
HF layer | 152 dB** |
Frequency
Frequency Resp. (±3 dB) | 100 - 18,000 Hz |
Frequency Resp. (-10 dB) | 85 - 20,000 Hz |
Processing
Type | High-performance FPGA for advanced digital signal processing |
DSP channels | 96 |
Computation | 7600 parametric EQ bands and more than 1100 Finite Impulse Response (FIR) filters with over 430000 filter taps |
Beamforming capabilities: HOLOPLOT 3D Audio Beamforming Technology and Wave Field Synthesis
Number of beams |
Up to 12 beams in parallel per X1 Matrix Array:
|
Vertical directivity | Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage |
Horizontal directivity | Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage |
Amplification
Type | 6x 16-channel digital amplifier modules |
Max. output power |
HF: 78x 240 Wpk LF: 18x 500 Wpk |
Connectors
Control | etherCON for Control Network |
Audio | etherCON for Audio-over-IP: Dante™, AES67 |
Power |
AC Power IN (115 - 240 V AC, 50 - 60 Hz) AC Power OUT (208 - 240 V AC, 50 - 60 Hz) |
Measurements
Dimensions | 800 mm x 600 mm x 457 mm (±2.5 mm) |
Weight | 100 kg / 220 lb |
Configuration: Three-layer Matrix Arrangement
Sub layer | 1x 18-inch sensor-controlled subwoofer with two high energy, high density neodymium-iron-boron magnets in a bandpass enclosure with air-flow optimised ports |
LF layer | 16x 5-inch cone driver in individual dual-ported chambers |
HF layer | 64x 1.3-inch soft dome tweeter with integrated waveguides |
Maximum SPL (one unit, optimized parallel beam configuration*)
Sub layer | 131 dB (full space) / 137 dB (half space)** |
LF layer | 142 dB** |
HF layer | 152 dB** |
Frequency
Frequency Resp. (±3 dB) | 30 - 18,000 Hz |
Frequency Resp. (-10 dB) | 26 - 20,000 Hz |
Processing
Type | High-performance FPGA for advanced digital signal processing |
DSP channels | 81 |
Computation | 7600 parametric EQ bands and more than 1100 Finite Impulse Response (FIR) filters with over 430000 filter taps |
Beamforming capabilities: HOLOPLOT 3D Audio Beamforming Technology and Wave Field Synthesis
Number of beams |
Up to 12 beams in parallel per X1 Matrix Array:
|
Vertical directivity | Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage |
Horizontal directivity | Steering angle and opening angle user adjustable (0.1° steps) / defined by HOLOPLOT Algorithm for optimized coverage |
Amplification
Type |
5x 16-channel digital amplifier modules
|
Max. output power |
Sub: 8,500 Wpk LF: 16x 500 Wpk HF: 64x 240 Wpk |
Connectors
Control | etherCON for Control Network |
Audio | etherCON for Audio-over-IP: Dante™, AES67 |
Power |
AC Power IN (115 - 240 V AC, 50 - 60 Hz) AC Power OUT (208 - 240 V AC, 50 - 60 Hz) |
Measurements
Dimensions | 800 mm x 600 mm x 981 mm (±2.5 mm) |
Weight | 160 kg / 353 lb |
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